The global hermetic packaging market size was valued at USD 4.21 billion in 2024. The market is projected to grow from USD 4.50 billion in 2025 to USD 7.31 billion by 2032, exhibiting a CAGR of 7.18% during the forecast period. Hermetic packaging is highly preferred in several medical and electronic devices for safe and reliable packaging. There is rising adoption of electronic devices due to a rise in government support for boosting digitalization and growing internet usage among customers. Rapid innovations in sealing technology are expected to fuel market expansion in the coming years.
Fortune Business Insights™ shares this information in its report titled “Hermetic Packaging Market, 2025-2032”.
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Segments
Increased Need for Complex Electronic Circuits Fuels Ceramic Metal Sealing Segment Growth
On the basis of type, the market is segregated into co-fired ceramic, metal can, epoxy seal, ceramic metal sealing, and glass metal sealing. The ceramic metal sealing segment leads the market. Increased need for complex electronic circuits, including microelectromechanical systems' multilayer ceramic metal sealing, is fostering segment expansion.
Rising Adoption of Suitable Packaging Strategies for Sensor Technologies Fuels Segment Expansion
In terms of application, the market is categorized into sensors, photodiodes, MEMS, transistors, laser chips, memory, and others. The sensors segment secures the largest hermetic packaging market share owing to the rising adoption of suitable packaging strategies for sensor technologies.
Rise in Government and Private Investments in Space Exploration Fosters Aerospace & Defense Segment Expansion
By end-use industry, the market is classified into aerospace & defense, healthcare, automotive, electrical & electronics, telecom, and others. The aerospace & defense segment commands the global market with the rise in government and private investments in space exploration.
From the regional ground, the market is classified into Europe, Latin America, North America, Asia Pacific, and the Middle East & Africa.
Drivers and Restraints
Increased Demand for Consumer Electronics to Bolster Market Expansion
Increased usage of consumer electronics is boosting the demand for hermetic packaging solutions. Growing purchasing power and rapid economic growth are fueling the sales of smartphones, which will eventually accelerate the demand for hermetic packaging. Rapid innovations in wireless mobile telecommunication technology, such as 4G, IoT, and 5G, are expected to fuel the adoption of other smart devices. The emergence of advanced household products and the growing usage of appliances equipped with voice assistance and Wi-Fi connectivity are the major factors contributing to market growth.
On the other hand, the hermetic packaging market growth is impeded by the emergence of not quite or almost hermetic packaging.
Regional Insights
Rise in Government Budget for the Aerospace & Defense Sector in China and Japan Augmented Market Growth in Asia Pacific
Asia Pacific dominates the global market. A rise in government budgets for the aerospace & defense sector, specifically in China and Japan, is driving market growth in the region.
Europe is predicted to register significant growth due to the presence of the world’s top automotive manufacturers. The increasing R&D activities within the space and automotive sectors are also boosting market growth in the region.
Competitive Landscape
Top Companies Concentrate on Acquisitions to Offer Next-generation Solutions
Key players in the market are TELEDYNE, SCHOTT, Amkor Technology, Inc., KYOCERA Corporation, Materion Corporation, Egide, SGA Technologies, Complete Hermetics, Coat-X SA, Mackin Technologies, and others. Many companies are focusing on acquisitions to offer next-generation solutions to the customers' product designs.
Key Industry Development
- March 2023: SCHOTT AG introduced hermetic packaging components for augmented reality. With its longstanding experience in glass-to-metal sealing, the company produces innovative packaging solutions for MEMS mirrors and RGB laser chips for augmented reality applications. The packaging solution strives to miniaturize and improve optoelectronic performance for augmented reality light engine systems.
List of Key Players Profiled in the Market Report:
- TELEDYNE (U.S.)
- SCHOTT (Germany)
- Amkor Technology, Inc. (U.S.)
- KYOCERA Corporation (Japan)
- Materion Corporation (U.S.)
- Egide (France)
- SGA Technologies (U.K.)
- Complete Hermetics (U.S.)
- Willow Technologies Ltd. (U.K.)
- Mackin Technologies (Japan)
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