Copper Paste Market Growth Analysis, Market Dynamics, Key Players and Innovations, Outlook and Forecast 2024-2030

Copper Paste Market Growth Analysis, Market Dynamics, Key Players and Innovations, Outlook and Forecast 2024-2030

Global Copper Paste Market:

• The market was valued at US$ 216.76 million in 2022.
• It is anticipated to reach US$ 310.47 million by 2029.
• The forecast period for this growth is from 2023 to 2029, with a Compound Annual Growth Rate (CAGR) of 4.94%.

Copper paste is made by mixing copper or copper alloy powders with a resin or organic binder. This forms a viscous paste that can be easily applied.

Japan Market:

• The Japan market for Copper Paste is estimated to increase from $ 99.87 million in 2023 to reach $ 139.25 million by 2029.
• The forecast period for the growth is from 2023 through 2029, with a CAGR of 4.47%.

China Market:

• The China market for Copper Paste is estimated to increase from $ 52.21 million in 2022 to reach $ 83.35 million by 2029.
• The forecast period for the growth is from 2023 through 2029, with a higher CAGR of 6.62%.

Major Manufacturers:

• Key global manufacturers of Copper Paste include Shoei Chemical, Sumitomo Metal Mining, TDK electronics (EPCOS), Kyoto Elex, Tatsuta, Chang Sung Corporation, Fenghua Advanced Technology, Ampletec, and NAMICS, among others.
• In 2022, the top three vendors worldwide accounted for approximately 37.75% of the revenue in the Copper Paste market.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Copper Paste, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Paste.

The Copper Paste market size, estimations, and forecasts are provided in terms of output/shipments (Kg) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Copper Paste market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Copper Paste manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

By Company

• Shoei Chemical
• Sumitomo Metal Mining
• TDK electronics (EPCOS)
• Kyoto Elex
• Chang Sung Corporation
• Tatsuta
• Fenghua Advanced Technology
• Ampletec
• NAMICS
• Mitsuboshi Belting
• Heraeus
• Sinocera
• Asahi Chemical
• Material Concept

Segment by Type

• Low Temperature Sintered
• Medium Temperature Sintered
• High Temperature Sintered

Segment by Application

• PCB
• MLCC
• Others

Production by Region

• North America
• Europe
• China
• Japan
• South Korea

Consumption by Region

• North America
  • U.S.
  • Canada

• Asia-Pacific
  • China
  • Japan
  • South Korea
  • China Taiwan
  • Southeast Asia
  • India

• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Russia
  • Rest of Europe

• South America
  • Mexico
  • Brazil
  • Rest of South America

key trends shaping the copper paste market:

Increasing use in photovoltaic industry - Silver-coated copper paste is being widely adopted for metallization of silicon solar cell busbars allowing move to thinner wafers driving down costs.

Demand growth in MLCC segment - Copper paste utilized heavily in inner electrode printing step of Multi-Layer Ceramic Capacitor (MLCC) fabrication. Market growing steadily with electronics adoption.

Adoption in heat sink applications - Use of copper particle-based pastes as thermal interface material between electronic components and heat sinks enablings better heat conduction.

Rising penetration in EVs/HEVs - Copper paste used to join internal components improving reliability and thermal conductivity demanded by high electrical loads in electric vehicles and hybrids.

Growth in flexible PCBs - Flex-PCB fabrication utilizing copper ink paste to form robust interconnections and contact surfaces within flexible circuits finding increased consumer electronics usage.

Paste advancements through nanotechnology - Use of novel copper nanoparticles and flakes aimed at achieving higher conductivity and lower processing temperatures relative to micro particle counterparts.

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