They help designers integrate more functionality into smaller areas and are finding applications in smartphones, automotive electronics, servers, and networking equipment where there is demand for compact form factors with increased capacities.
The global 3D ICs Market is estimated to be valued at US$ 19511.73 Bn in 2024 and is expected to exhibit a CAGR of 12% over the forecast period 2024 to 2031, as highlighted in a new report published by Coherent Market Insights.
Market key trends:
Emerging application areas such as artificial intelligence, virtual reality, and autonomous vehicles provide significant growth opportunities for 3D ICs. These advanced technologies require integration of more sensors and chips to support capabilities like connectivity, data processing, and high-speed computing. 3D chip stacking technology allows these components to be integrated more densely while meeting the stringent space and performance requirements of devices used in such applications. The 3D ICs market is expected to be driven by increasing demand from AI chips, cellular base stations, and autonomous vehicles that require stacked die configurations to achieve intelligence, bandwidth, and computational power for their complex functionalities.
Segment Analysis
The Global 3D Ics Market Demand is dominated by 3D through silicon via (TSV) sub-segment. 3D TSV allows high density interconnects between stacked silicon wafers or dies and provides improved performance over traditional chip packaging. It enables heterogeneous and homogenous stacking of various chips through reliable vertical electrical interconnects within a single package. This technology reduces footprint and powers consumption by allowing tighter integration between the chips.
Key Takeaways
The global 3D ICs market is expected to witness high growth during the forecast period of 2024 to 2031. The global 3D ICs Market is estimated to be valued at US$ 19511.73 Bn in 2024 and is expected to exhibit a CAGR of 12% over the forecast period 2024-2031.
Regional analysis related content comprises
The Asia Pacific region currently dominates the global 3D ICs market with more than 40% revenue share in 2024. Rapid digitization and industrial automation across industries such as consumer electronics, aerospace & defense, automotive is driving the market growth in the region. Additionally, strong presence of semiconductor fabrication facilities in China, Taiwan, South Korea is contributing to the regional market growth. The market in Asia Pacific is expected to grow at a CAGR of around 14% during the forecast period.
Key players related content comprises
Key players operating in the 3D ICs market are Aquahydrex, Inc., Xilinx Inc., Taiwan Semiconductor Manufacturing Company Limited, United Microelectronics Corporation, Samsung Electronics Co., Ltd, and Toshiba Corporation. Aquahydrex, Inc. is one of the prominent players in the global market and offers 3D IC products and services for various applications in consumer electronics, automotive, and healthcare sectors.
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