The Adoption Of Flexible Hybrid Electronics Market Is Driven By The Miniaturization Of Electronic Devices
The Adoption Of Flexible Hybrid Electronics Market Is Driven By The Miniaturization Of Electronic Devices
The development of flexible electronics relies on advances in materials engineering, chemistry and micro fabrication techniques.

The Adoption Of Flexible Hybrid Electronics Market Is Driven By The Miniaturization Of Electronic Devices

Flexible hybrid electronics consist of miniaturized electronic devices that are printed or deposited on thin, flexible plastic substrates using materials such as organic and inorganic semiconductors, conductors, dielectric substrates and encapsulating layers. These electronic devices primarily include sensors, batteries, displays and logic circuitry chips that can be integrated into curved or stretchable surfaces for applications ranging from wearable devices to medical implants. Flexible electronics offer significant advantages over their rigid silicon-based counterparts such as lightweight, thinness, durability, mechanical flexibility and large area coverage. These properties allow flexible electronics to be easily integrated into fabrics, biological tissues and non-planar surfaces.

The global flexible hybrid electronics market is estimated to be valued at US$ 139.62 million in 2023 and is expected to exhibit a CAGR of 10% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.

Market key trends:
Some of the key trends driving the demand for flexible hybrid electronics include development of advanced biocompatible materials for implantable medical devices such as wearable patient monitors, flexible thin-film photovoltaics for harvesting energy from uneven surfaces and flexible displays in smartphones and tablet computers for delivering an immersive user experience. New thin-film transistor technologies enable enhanced functionality, sensitivity and stretchability required for applications ranging from artificial electronic skins to smart biomedical adhesives. Advances in additive manufacturing processes such as aerosol jet printing and inkjet printing are enabling low-cost, large-area deposition of complex circuitry on diverse substrates including glass, plastic and biological tissues for developing novel application concepts.


Porter's Analysis

Threat of new entrants: New entrants face high capital requirement. Bargaining power of buyers: Buyers have moderate to high bargaining power due to the availability of substitutes. Bargaining power of suppliers: Suppliers have moderate bargaining power due to availability of alternatives. Threat of new substitutes: Substitutes like printed electronics and rigid PCBs pose moderate threat. Competitive rivalry: Intense competition among existing players.

Key Takeaways

The Global Flexible Hybrid Electronics Market Size is expected to witness high growth. Regional analysis: North America is expected to dominate the market over the forecast period owing to advancements in healthcare, defense and aerospace sectors in the US and Canada. Key players: Key players operating in the flexible hybrid electronics market are DuPont Teijin Films, PARC (Xerox Corporation), General Electric Company, Lockheed Martin Corporation, American Semiconductor Inc., Flex Ltd., Brewer Science Inc., Integrity Industrial Inkjet Integration, and SI2 Technologies Inc.

Regional analysis: Asia Pacific is anticipated to grow at the fastest rate during the forecast period due to rising population, increasing urbanization and growing electronics industry in countries like China, Japan, South Korea and India.

Key players: Key players operating in the flexible hybrid electronics market are DuPont Teijin Films, PARC (Xerox Corporation), General Electric Company, Lockheed Martin Corporation, American Semiconductor Inc., Flex Ltd., Brewer Science Inc., Integrity Industrial Inkjet Integration, and SI2 Technologies Inc. Flexible hybrid electronics technology enables integration of electronic and photonic components on plastic and other flexible substrates which are thinner, lighter and more robust than rigid PCBs.

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https://www.marketwebjournal.com/flexible-hybrid-electronics-market-market-size-and-share-analysis/

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